Chuang, T. H.T. H.ChuangYu, C. L.C. L.YuChang, S. Y.S. Y.ChangWang, S. S.S. S.WangChuangTH2009-01-062018-06-282009-01-062018-06-28200203615235http://ntur.lib.ntu.edu.tw//handle/246246/95932https://www.scopus.com/inward/record.uri?eid=2-s2.0-0036610350&doi=10.1007%2fs11664-002-0136-1&partnerID=40&md5=d819d10502ebeb70ead4de1642d9bdb0For the application of In-49Sn solder in bonding recycled-sputtering targets to Cu back plates, the intermetallic compounds formed at the In-49Sn/Cu interface are investigated. Scanning electron microscopy (SEM) observations show that the interfacial intermetallics consist of a planar layer preceded by an elongated scalloped structure. Electron-probe microanalyzer analyses indicate that the chemical compositions of the planar layer and the scalloped structure are Cu74.8In12.2Sn13.0 and Cu56.2In20.1Sn23.7, respectively, which correspond to the ε-Cu3(In,Sn) and η-Cu6(In,Sn)5 phases. Kinetics analyses show that the growth of both intermetallic compounds is diffusion controlled. The activation energies for the growth of η- and ε-intermetallics are calculated to be 28.9 kJ/mol and 186.1 kJ/mol. Furthermore, the formation mechanism of intermetallic compounds during the In-49Sn/Cu soldering reaction is clarified by marking the original interface with a Ta-thin film. Wetting tests are also performed, which reveal that the contact angles of liquid In-49Sn drops on Cu substrates decline to an equilibrium value of 25°C.application/pdf362535 bytesapplication/pdfen-USIn-49Sn/Cu; Intermetallic compounds; SolderingActivation energy; Composition; Contact angle; Copper; Diffusion in solids; Grain growth; Growth kinetics; Indium alloys; Scanning electron microscopy; Soldering; Soldering alloys; Wetting; Electron probe microanalysis; Indium tin alloy; Interfacial reactions; Mechanical behavior; Wetting tests; Intermetallicsjournal article2-s2.0-0036610350http://ntur.lib.ntu.edu.tw/bitstream/246246/95932/1/73.pdf