Mechanical behavior of flip chip packages under thermal loading

Inst. of Appl. Mech., National Taiwan Univ.Chen, ShoulungShoulungChenTsai, C.Z.C.Z.TsaiKao, NicholasNicholasKaoWu, EnboaEnboaWu2007-04-192018-06-292007-04-192018-06-292005-06http://ntur.lib.ntu.edu.tw//handle/246246/200704191001150application/pdf441067 bytesapplication/pdfen-USMechanical behavior of flip chip packages under thermal loadingother10.1109/ECTC.2005.1442017http://ntur.lib.ntu.edu.tw/bitstream/246246/200704191001150/1/01442017.pdf