Reaction kinetics of solder-balls with pads in BGA packages during reflow soldering

Ho C.E.Chen Y.M.C. ROBERT KAO2019-11-272019-11-27199903615235https://www.scopus.com/inward/record.uri?eid=2-s2.0-0033221504&doi=10.1007%2fs11664-999-0162-3&partnerID=40&md5=800c2c02ac59008364e80d525103cd70https://scholars.lib.ntu.edu.tw/handle/123456789/432749Reaction kinetics of solder-balls with pads in BGA packages during reflow solderingjournal article10.1007/s11664-999-0162-32-s2.0-0033221504