Glycolic acid in hydrogen peroxide-based slurry for enhancing copper chemical mechanical polishing

Tsai, Tzu-HsuanTzu-HsuanTsaiWu, Yung-FuYung-FuWuYen, Shi-ChernShi-ChernYen2008-12-172018-06-282008-12-172018-06-282005http://ntur.lib.ntu.edu.tw//handle/246246/92350application/pdf526749 bytesapplication/pdfen-USGlycolic acid in hydrogen peroxide-based slurry for enhancing copper chemical mechanical polishingjournal articlehttp://ntur.lib.ntu.edu.tw/bitstream/246246/92350/1/08.pdf