Cross-interaction between Ni and Cu across a high-lead solder joint with different solder volume

Chang C.C.C. ROBERT KAO2019-11-272019-11-2720109781424497836https://www.scopus.com/inward/record.uri?eid=2-s2.0-79951642363&doi=10.1109%2fIMPACT.2010.5699505&partnerID=40&md5=88762a6ef7471872ea490d42be4cec4ahttps://scholars.lib.ntu.edu.tw/handle/123456789/432652Cross-interaction between Ni and Cu across a high-lead solder joint with different solder volumeconference paper10.1109/IMPACT.2010.56995052-s2.0-79951642363