Self-assembly of reduced Au atoms for vertical interconnections in three dimensional integrated circuits

Weng I.A.Hung H.T.Yang S.Kao C.R.Chen Y.H.C. ROBERT KAO2019-11-272019-11-27201913596462https://www.scopus.com/inward/record.uri?eid=2-s2.0-85053523247&doi=10.1016%2fj.scriptamat.2018.09.026&partnerID=40&md5=f44bf454c3d36cb827358778364bb655https://scholars.lib.ntu.edu.tw/handle/123456789/432569Self-assembly of reduced Au atoms for vertical interconnections in three dimensional integrated circuitsjournal article10.1016/j.scriptamat.2018.09.0262-s2.0-85053523247