Low-temperature, pressureless Cu-to-Cu bonding by electroless Ni plating

Yang S.Hung H.T.Chen Y.B.C. ROBERT KAO2019-11-272019-11-272016978150904769721505934https://www.scopus.com/inward/record.uri?eid=2-s2.0-85009840561&doi=10.1109%2fIMPACT.2016.7800038&partnerID=40&md5=240fe2a906117dff8be990e94de363eahttps://scholars.lib.ntu.edu.tw/handle/123456789/432592Low-temperature, pressureless Cu-to-Cu bonding by electroless Ni platingconference paper10.1109/IMPACT.2016.78000382-s2.0-85009840561