Solid Liquid Interdiffusion Bonding of (Pb, Sn)Te Thermoelectric Modules with Cu Electrodes Using a Thin-Film Sn Interlayer

Chuang, T.H.T.H.ChuangLin, H.J.H.J.LinChuang, C.H.C.H.ChuangYeh, W.T.W.T.YehHwang, J.D.J.D.HwangChu, H.S.H.S.ChuTUNG-HAN CHUANG2020-05-122020-05-122014https://scholars.lib.ntu.edu.tw/handle/123456789/491975Solid Liquid Interdiffusion Bonding of (Pb, Sn)Te Thermoelectric Modules with Cu Electrodes Using a Thin-Film Sn Interlayerjournal article10.1007/s11664-014-3430-92-s2.0-84925519901https://www.scopus.com/inward/record.uri?eid=2-s2.0-84925519901&doi=10.1007%2fs11664-014-3430-9&partnerID=40&md5=2bcf337e7223c836f0216e79412de550