Chiang, Ching WenChing WenChiangCHUNG-TSE WULiu, Nai ChenNai ChenLiuLiang, Chia JenChia JenLiangKuan, Yen ChengYen ChengKuan2024-03-052024-03-052022-05-0121563950https://scholars.lib.ntu.edu.tw/handle/123456789/640307This article presents a cost-effective millimeter-wave (W-band) cavity-backed slot antenna-in-package (AiP) built using commercially available integrated passive device (IPD), printed circuit board (PCB), and flip-chip assembly technologies. An IPD-PCB resonant cavity is formed by flipping an IPD chip on a PCB substrate with surrounding solder bumps to provide radiation through a square slot, which is patterned on one of the IPD metal layers. Moreover, a substrate-integrated waveguide (SIW) cavity under the IPD-PCB cavity and a wideband-grounded coplanar waveguide (GCPW) are built in the PCB substrate for the transition between a radio frequency front-end (RFFE) and the IPD-PCB cavity. The fabricated AiP achieves a 3.75-dBi gain at 94.5 GHz (TE210 mode) and a 10-dB impedance bandwidth of 1.9 GHz with a 3.61 mm2 IPD chip area.Antenna-in-package (AiP) | bumps | cavity antenna | flip-chip | grounded coplanar waveguide (GCPW) | heterogeneous integration (HI) | integrated passive device (IPD) | millimeter-wave (mmWave) | printed circuit board (PCB) | substrate-integrated waveguide (SIW) | W-band[SDGs]SDG7journal article10.1109/TCPMT.2022.31704992-s2.0-85129410113https://api.elsevier.com/content/abstract/scopus_id/85129410113