Chemical-mechanical polishing of low dielectric constant poly(silsesquioxane): HSQ

WEN-CHANG CHENYen, C.-T.C.-T.Yen2018-09-102018-09-101999http://www.scopus.com/inward/record.url?eid=2-s2.0-0033326173&partnerID=MN8TOARShttp://scholars.lib.ntu.edu.tw/handle/123456789/348054Chemical-mechanical polishing of low dielectric constant poly(silsesquioxane): HSQjournal article10.1007/s10965-006-0088-x2-s2.0-0033326173WOS:000084675000008