In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressing

Lin Y.H.Hu Y.C.Tsai C.M.Kao C.R.Tu K.N.C. ROBERT KAO2019-11-272019-11-27200513596454https://www.scopus.com/inward/record.uri?eid=2-s2.0-14544277886&doi=10.1016%2fj.actamat.2005.01.014&partnerID=40&md5=4860c33baacfca6f74d9e6c5f6bb98d2https://scholars.lib.ntu.edu.tw/handle/123456789/432716[SDGs]SDG14In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressingjournal article10.1016/j.actamat.2005.01.0142-s2.0-14544277886