Au and Pd embrittlement in space-confined soldering reactions for 3D IC applications

Chen Y.J.Huang K.Y.Chen H.T.C. ROBERT KAO2019-11-272019-11-27201315505723https://www.scopus.com/inward/record.uri?eid=2-s2.0-84878871756&doi=10.1109%2fISAPM.2013.6510393&partnerID=40&md5=070027945347d8e899763b8452076dfehttps://scholars.lib.ntu.edu.tw/handle/123456789/432626Au and Pd embrittlement in space-confined soldering reactions for 3D IC applicationsconference paper10.1109/ISAPM.2013.65103932-s2.0-84878871756