2008-08-012024-05-17https://scholars.lib.ntu.edu.tw/handle/123456789/680558摘要：電子元件接點材料以銲錫合金為主，這些銲錫接點在大氣環境長期置放可能產生鬚晶(whiskers)，其成分接近純錫，長度可達到數百微米，此將造成短路及元件失效，影響鬚晶成長速率的因素包括：溫度、濕氣、壓應力及通電流，而有關鬚晶的成長機制文獻上已經有一些報導，但各家說法並不完全一致。 由於一般鬚晶的成長速率較慢，觀察需要很長的時間，研究很不方便，無法有系統將各種影響鬚晶成長因素完整考量，這也是造成目前鬚晶成長機制的理論均不甚完善。本實驗室首度發現在含稀土元素銲錫接點表面出現錫鬚極快速成長現象，其在室溫的成長速率可達每秒0.86奈米, 遠超過一般文獻報導的錫鬚成長速率（大約每秒0.001至0.01奈米），此提供錫鬚成長機制很方便的實驗系統。本博士後研究將利用含稀土銲錫合金有系統的進行錫鬚成長機制研究。 <br> Abstract: Solder alloys have been widely used as the joining material of electronic devices. These solder joints might result in the formation of whiskers. The whiskers possess a composition near pure tin and a length over hundreds um, which could lead to the short circuiting and failure of electronic products. The parameters for the whisker growth include: temperature、humidity、compressive stress and applied current. The growth mechanisms of tin whiskers have been reported by some researchers, which are quite inconsistent. In general, the tin whiskers grow very slowly and the observations require much time, it is difficult for the study of whisker growth mechanism. Our laboratory found for the first time that the phenomenon of amazingly rapid growth occurred on the surface of rare earth- elements containing solders. The growth velocity at room temperature attains 0.86nm/sec, which is mech higher than rates reported in the literature (0.001 to 0.01nm/sec). The rare earth elements-containing solder alloys provide very convenient experimental system for the investigation of tin whiskers. The effort of this post-doctoral project is concerned with systematic studies of the growth mechanism of tin whiskers by using the rare earth doped solders.