Erratum: Intermetallic compounds formed during the reflow and aging of Sn-3.8Ag-0.7Cu and Sn-20ln-2Ag-0.5Cu solder ball grid arrav packaaes(Journal of Electronics Materials (March 2004) 33 (171-180))

Cheng, M.D.M.D.ChengChang, S.Y.S.Y.ChangYen, S.F.S.F.YenChuang, T.H.T.H.ChuangTUNG-HAN CHUANG2020-05-122020-05-122004https://scholars.lib.ntu.edu.tw/handle/123456789/492018Erratum: Intermetallic compounds formed during the reflow and aging of Sn-3.8Ag-0.7Cu and Sn-20ln-2Ag-0.5Cu solder ball grid arrav packaaes(Journal of Electronics Materials (March 2004) 33 (171-180))other2-s2.0-3242721413https://www.scopus.com/inward/record.uri?eid=2-s2.0-3242721413&partnerID=40&md5=45bf1380d77bdb15a52331fe1cd40066