Intermetallic Compounds Formed in Sn-20In-2.8Ag Solder BGA Packages with Ag/Cu Pads

Jain, C. C.C. C.JainSTEVEN SHENG-SHIH WANGHuang, K. W.K. W.HuangTUNG-HAN CHUANG2020-01-062020-01-0620091059-9495https://scholars.lib.ntu.edu.tw/handle/123456789/445796Intermetallic Compounds Formed in Sn-20In-2.8Ag Solder BGA Packages with Ag/Cu Padsjournal article10.1007/s11665-008-9292-7WOS:000263063600013