How to improve chip strength to avoid die cracking in a package

Inst. of Appl. Mech., National Taiwan Univ.Chen, ShoulungShoulungChenShih, I.G.I.G.ShihChen, Y.N.Y.N.ChenTsai, C.Z.C.Z.TsaiLin, J.W.J.W.LinWu, EnboaEnboaWu2007-04-192018-06-292007-04-192018-06-292004-06http://ntur.lib.ntu.edu.tw//handle/246246/200704191002737application/pdf522828 bytesapplication/pdfen-USHow to improve chip strength to avoid die cracking in a packageother10.1109/ITHERM.2004.1318292http://ntur.lib.ntu.edu.tw/bitstream/246246/200704191002737/1/01318292.pdf