Chuang, T.H.T.H.ChuangWu, H.F.H.F.WuHuang, K.W.K.W.HuangYen, S.F.S.F.YenLin, H.J.H.J.Lin2009-01-062018-06-282009-01-062018-06-282004http://ntur.lib.ntu.edu.tw//handle/246246/95994en-USMorphology and Growth Kinetics of Intermetallics Formed during the Interfacial Reactions of Solder Jointsjournal article