Effect of surface finish on the failure mechanisms of flip-chip solder joints under electromigration

Lin Y.L.Lai Y.S.Tsai C.M.C. ROBERT KAO2019-11-272019-11-27200603615235https://www.scopus.com/inward/record.uri?eid=2-s2.0-33846430875&doi=10.1007%2fs11664-006-0325-4&partnerID=40&md5=830dbe8dd33443e75fde1351c2287f8fhttps://scholars.lib.ntu.edu.tw/handle/123456789/432700Effect of surface finish on the failure mechanisms of flip-chip solder joints under electromigrationconference paper10.1007/s11664-006-0325-42-s2.0-33846430875