Effects of Sn grain orientation on substrate dissolution and intermetallic precipitation in solder joints under electron current stressing

Huang T.C.Yang T.L.Ke J.H.Hsueh C.H.CHUN-HWAY HSUEHC. ROBERT KAO2019-11-272019-11-27201413596462https://www.scopus.com/inward/record.uri?eid=2-s2.0-84897915232&doi=10.1016%2fj.scriptamat.2014.02.010&partnerID=40&md5=fc684539074d569d75e2bdbe02a4fde9https://scholars.lib.ntu.edu.tw/handle/123456789/432620Effects of Sn grain orientation on substrate dissolution and intermetallic precipitation in solder joints under electron current stressingjournal article10.1016/j.scriptamat.2014.02.0102-s2.0-84897915232