Formation and growth of intermetallics in an annealing-twinned Ag-8Au-3Pd wire bonding package during reliability tests

Chuang, T.-H.T.-H.ChuangChang, C.-C.C.-C.ChangChuang, C.-H.C.-H.ChuangLee, J.-D.J.-D.LeeTsai, H.-H.H.-H.TsaiTUNG-HAN CHUANG2020-05-122020-05-122013https://scholars.lib.ntu.edu.tw/handle/123456789/491982Formation and growth of intermetallics in an annealing-twinned Ag-8Au-3Pd wire bonding package during reliability testsjournal article10.1109/TCPMT.2012.22210902-s2.0-84872268084https://www.scopus.com/inward/record.uri?eid=2-s2.0-84872268084&doi=10.1109%2fTCPMT.2012.2221090&partnerID=40&md5=198bc36e6f1a14d8e13164e770f303a8