Solid Liquid Interdiffusion Bonding of Zn<inf>4</inf>Sb<inf>3</inf> Thermoelectric Material with Cu Electrode

Lin, Y.C.Y.C.LinLee, K.T.K.T.LeeHwang, J.D.J.D.HwangChu, H.S.H.S.ChuHsu, C.C.C.C.HsuChen, S.C.S.C.ChenChuang, T.H.T.H.ChuangTUNG-HAN CHUANG2020-05-122020-05-122016https://scholars.lib.ntu.edu.tw/handle/123456789/491961Solid Liquid Interdiffusion Bonding of Zn<inf>4</inf>Sb<inf>3</inf> Thermoelectric Material with Cu Electrodejournal article10.1007/s11664-016-4645-82-s2.0-84984600749https://www.scopus.com/inward/record.uri?eid=2-s2.0-84984600749&doi=10.1007%2fs11664-016-4645-8&partnerID=40&md5=34bd062614f11a746a72022d7084e4a3