Intermetallic reactions in a Sn-51In solder BGA package with immersion Ag surface finish

Jain, C.-C.C.-C.JainWang, S.-S.S.-S.WangWu, H.-M.H.-M.WuChuang, T.-H.T.-H.ChuangTUNG-HAN CHUANG2020-05-122020-05-122009https://scholars.lib.ntu.edu.tw/handle/123456789/491998Intermetallic reactions in a Sn-51In solder BGA package with immersion Ag surface finishjournal article10.1080/02533839.2009.96714992-s2.0-63449103392https://www.scopus.com/inward/record.uri?eid=2-s2.0-63449103392&doi=10.1080%2f02533839.2009.9671499&partnerID=40&md5=dbbe1fca14863c1f69773e8e93bfbcc2