Effects of Ce and Zn additions on the microstructure and mechanical properties of Sn-3Ag-0.5Cu solder joints

Lin, Hsiu-JenHsiu-JenLinChuang, Tung-HanTung-HanChuang2012-10-242018-06-282012-10-242018-06-282010http://ntur.lib.ntu.edu.tw//handle/246246/243873en-USEffects of Ce and Zn additions on the microstructure and mechanical properties of Sn-3Ag-0.5Cu solder jointsjournal article10.1016/j.jallcom.2010.03.233http://ntur.lib.ntu.edu.tw/bitstream/246246/243873/-1/317.pdf