Fundamental study of 95 high-lead solder bump on substrates pre-soldered with eutectic PbSn

Chang C.-C.Lin C.-C.C. ROBERT KAO2019-11-272019-11-2720099781424443413https://www.scopus.com/inward/record.uri?eid=2-s2.0-77950847877&doi=10.1109%2fIMPACT.2009.5382312&partnerID=40&md5=a3e54df5d295ce2f2123e763aa354dc8https://scholars.lib.ntu.edu.tw/handle/123456789/432671Fundamental study of 95 high-lead solder bump on substrates pre-soldered with eutectic PbSnconference paper10.1109/IMPACT.2009.53823122-s2.0-77950847877