Transmission Electron Microscopy Characterization of Ni(V) Metallization Stressed Under High Current Density in Flip Chip Solder Joints

Tsai, M.Y.M.Y.TsaiLin, Y.L.Y.L.LinLin, Y.W.Y.W.LinKe, J.H.J.H.KeC. ROBERT KAO2012-10-242018-06-282012-10-242018-06-282010http://ntur.lib.ntu.edu.tw//handle/246246/243823en-USTransmission Electron Microscopy Characterization of Ni(V) Metallization Stressed Under High Current Density in Flip Chip Solder Jointsjournal article10.1007/s11664-010-1376-02-s2.0-78049528928http://ntur.lib.ntu.edu.tw/bitstream/246246/243823/-1/267.pdf