Modeling noise coupling between package and PCB power/ground planes with an efficient 2-D FDTD/lumped element method

T.-K. WangS.-T. ChenC.-W. TsaiS.-M. WuJ. J. DrewniakTZONG-LIN WU2018-09-102018-09-102007-11http://scholars.lib.ntu.edu.tw/handle/123456789/333828Modeling noise coupling between package and PCB power/ground planes with an efficient 2-D FDTD/lumped element methodjournal article10.1109/tadvp.2007.9017642-s2.0-36348967803WOS:000250897200029