Redistribution layer routing for integrated fan-out wafer-level chip-scale packages

Lin, B.-Q.B.-Q.LinLin, T.-C.T.-C.LinYAO-WEN CHANG2020-06-162020-06-162016https://scholars.lib.ntu.edu.tw/handle/123456789/502003Redistribution layer routing for integrated fan-out wafer-level chip-scale packagesconference paper10.1145/2966986.29670702-s2.0-85001132532https://www.scopus.com/inward/record.uri?eid=2-s2.0-85001132532&doi=10.1145%2f2966986.2967070&partnerID=40&md5=989e8c076d5e83d234403803d9766d92