Effects of the gold thickness of the surface finish on the interfacial reactions in flip-chip solder joints

Lin Y.L.Luo W.C.Lin Y.H.Ho C.E.C. ROBERT KAO2019-11-272019-11-27200403615235https://www.scopus.com/inward/record.uri?eid=2-s2.0-7044223296&doi=10.1007%2fs11664-004-0109-7&partnerID=40&md5=4600ca4f4c252c1a716a42ef72511822https://scholars.lib.ntu.edu.tw/handle/123456789/432720Effects of the gold thickness of the surface finish on the interfacial reactions in flip-chip solder jointsjournal article10.1007/s11664-004-0109-72-s2.0-7044223296