New temperature compensation method for Si wafers in rapid thermal processor using separated Si rings as susceptors

JENN-GWO HWU2018-09-102018-09-101997http://www.scopus.com/inward/record.url?eid=2-s2.0-0031357581&partnerID=MN8TOARShttp://scholars.lib.ntu.edu.tw/handle/123456789/329949New temperature compensation method for Si wafers in rapid thermal processor using separated Si rings as susceptorsconference paper