Fang, I. C.I. C.FangChang, F. L.F. L.ChangChang, C. C.C. C.ChangC. ROBERT KAO2023-07-242023-07-242023-01-019784991191152https://scholars.lib.ntu.edu.tw/handle/123456789/634041In this research, the interfacial reactions between solid silver and solid indium are discussed. The samples are fabricated by electroplating indium on silver substrates and then underwent aging at 80, 100 and 120. After aging, two intermetallic compounds (IMCs) layers, Ag2In and AgIn2, were found at the interface of silver and indium. Both I MCs grow with time during the aging process. The growth rate of Ag2In and AgIn2 increases with temperature and follows parabolic law, implying that the growth of Ag2In and AgIn2 are both diffusion-controlled reactions.indium | interfacial reaction | intermetallic compounds | kinetics | silverconference paper10.23919/ICEP58572.2023.101297482-s2.0-85161899369https://api.elsevier.com/content/abstract/scopus_id/85161899369