2019-06-012024-05-17https://scholars.lib.ntu.edu.tw/handle/123456789/695856摘要：習知的材料接合技術均為點狀或線狀熔銲，然而工程上常需要大面積及高強度，針對此需求，共晶接合與過渡液相接合提供了有效的解決方案，共晶接合技術是利用待接合材料在其界面發生共晶反應進而局部熔融，冷卻凝固後達到接合目的；另方面，過渡液相接合技術則是利用施加低於待接合材料熔點的填充金屬層在接合界面熔融，並進行等溫凝固反應及均質化步驟，使填充金屬元素幾乎完全固熔到母材基地，完成接近無異質界面的完美材料接合效應。本計畫針對6061AlMgSi、 2024AlCu及7075AlZnMg等3種航空級鋁合金的大面積接合需求開發共晶接合與過渡液相接合技術。共晶接合的研發重點鎖定在減少界面共晶反應脆性生成物的影響，以提升接合強度；過渡液相接合的研發焦點在於縮短接合時間，以避免鋁合金晶粒過度成長，並改善製程效率。共晶接合的中間夾層包含:電鍍銅(Cu)薄膜、施加銅箔及熱噴塗銅鍍層，並導入適當合金元素；過渡液相接合的中間夾層則包含:濺鍍鍺(Ge)、銅(Cu)、銀(Ag)薄膜及熱噴塗低熔點Al-Si-X (X=Cu、Zn、Mg、Ge)合金夾層。本計畫針對此兩種接合技術設定指標為:接合強度>80MPa、接合率>95%、界面孔隙率<3%。 <br> Abstract: Conventional material joining techniques are point- or line- melting bonding. However, large area joining with high strength is often required in engineering. For this purpose, eutectic bonding and transient liquid phase bonding methods provide an effective solution. Eutectic bonding technology uses the eutectic reaction occurring at the interface of joining materials leading to the local melting and solidification to attain the bonding effect. On the other hand, transient liquid phase bonding method is achieved by applying a filler metal layer with a melting point lower than that of the joining material, following with isothermal solidification and homogenization processes, leading to a complete solid solution of the filler elements into the matrix of joining material and a perfect bonding effect nearly without dismiliar material interface. The effort of this project is aimed at the requirement of large area joining of 3 aeronautical grade 6061AlMgSi, 2024AlCu, and 7075AlZnMg aluminum alloys to develop the eutectic bonding and transient liquid phase bonding techniques. The research keypoint of eutectic bonding aims at the diminish of brittle eutectic phase products formed at the bonding interface for the increase of bonding strength. The research of transient liquid phase bonding is focused on the decrease of bonding duration to prevent the overgrowth of Al grain size and improve the manufacturing process efficiency. The interlayers for eutectic bonding involve electroplating Cu film, applying Cu foil and thermal spraying Cu layer. In addition, adequate alloy elements will also be employed. For the transient liquid phase bonding, sputtering Ge, Cu, Ag thin films and thermal spraying low melting point Al-Si-X (X=Cu、Zn、Mg、Ge) alloy layers will be considered as the interlayers for this joining process. The KPI for both joining techniques are: bonding strength>80MPa、bonding ratio>95%、interface voids<3%航空級鋁合金大面積接合共晶接合過渡液相接合Aeronautical grade Al alloyslarge area joiningeutectic bondingtransient liquid phase bonding.