Improving the sidewall quality of nanosecond laser-drilled deep through-silicon vias by incorporating a wet chemical etching process

Chao-Wei TangKuan-Ming LiHong-Tsu YoungHONG-TSU YOUNG2021-11-222021-11-222012http://jjap.jsap.jp/link?JJAP/51/06FL03/https://scholars.lib.ntu.edu.tw/handle/123456789/587662Improving the sidewall quality of nanosecond laser-drilled deep through-silicon vias by incorporating a wet chemical etching processjournal article