莊東漢2006-07-252018-06-282006-07-252018-06-282004http://ntur.lib.ntu.edu.tw//handle/246246/12481本計畫之「等溫固凝固微熱壓成型」技術構想是將一高熔點金屬粉末(Ni、Cu、Ag)與一室溫液態之共晶合金(Ga-24.6 In Ga13.7 Sn)調成膏狀，此一室溫呈膏狀之原料在微熱壓成型模 具內加熱熔解(溫度在350℃以下)，接著繼續在此溫度進行等溫凝固反應(時間30 秒至30 分鐘，必要時再延長)，此界面反應將形成固態之介金屬化合物，成型後的金屬微形元件材質為完 全單一介金屬相或高熔點金屬顆料外覆介金屬基地之複材組織。本計晝第一年先探討各金屬組合界面所進行之固液擴散及等溫凝固反應，分析其所生成介金屬相成份及其成長動力學，後續研究將針對所構想之創新成型方法評估其可行性。“The Isothermal Hot Embossing Process” under consideration in this project entails the blending of a high-melting-point metallic powder (Ni、Cu or Ag) with a eutectic alloy (Ga24.6In or Ga13.7Sn) which exists in liquid state at room temperature ,whereas the mixtures in paste at room temperature will be heated and partially molten in a hot embossing mould at a temperature below 350℃. The partially liquid mixtures subsequently spur on the isothermal solidification reaction at the same temperature (reaction time:30sec to 30min, or longer if necessary). Solid intermetallic compounds are expected to form after such interfacial reactions, which will substitute the previous liquid or low-melting-point components. The resultant metallic micro-devices will be found to possess a single-phase microstructure consisting of purely monolithic intermetallics, or to form a composite phase of high-melting-point metallic powder held in place by the surrounding intermetallic matrix. During the first year of this project, the solid-liquid interdiffusion and isothermal solidification reaction occurred at the interfaces of various metallic mixtures will be systematically investigated. Chemical compositions and growth kinetics of the resulting intermetallic compounds will also be analyzed. Furthermore, a tryout-stage verification of the applicability of the 2 proposed innovative process will be initiated.application/pdf380083 bytesapplication/pdfzh-TW國立臺灣大學材料科學與工程學研究所微機電微熱壓成型等溫凝固固液擴散金屬微形元件MEMShot embossingisothermal solidificationsolid-liquid interdiffusionmetallic micro-devicesreporthttp://ntur.lib.ntu.edu.tw/bitstream/246246/12481/1/922216E002032.pdf