Heat Dissipation Through Thermal Rail Insertion in Face-to-Face 2 Layer Stacked 6T CFET SRAM

Juan B.H.Huang L.-C.Huang X.-T.TZU-HSUAN CHANG2025-10-272025-10-272025-01-01[9798331543129]https://scholars.lib.ntu.edu.tw/handle/123456789/732931falseHeat Dissipation Through Thermal Rail Insertion in Face-to-Face 2 Layer Stacked 6T CFET SRAMtext::conference output::conference proceedings::conference paper2-s2.0-105010817693