Study on CMP process of glass wafers with SiO2 based slurry for trench-glass-via interposer

Chen, C.-C.A.C.-C.A.ChenYoung, H.-T.H.-T.YoungChiou, C.-H.C.-H.ChiouXue, M.-Y.M.-Y.XuePan, C.-L.C.-L.PanHONG-TSU YOUNG2020-01-132020-01-132016https://scholars.lib.ntu.edu.tw/handle/123456789/447486Study on CMP process of glass wafers with SiO2 based slurry for trench-glass-via interposerconference paper10.1109/CSTIC.2016.74640342-s2.0-84974604196https://www.scopus.com/inward/record.uri?eid=2-s2.0-84974604196&doi=10.1109%2fCSTIC.2016.7464034&partnerID=40&md5=9e0c7773f59e5d32614ee971c4f8de14