A study of copper chemical mechanical polishing in urea–hydrogen peroxide slurry by electrochemical impedance spectroscopy

Tsai, Tzu-HsuanTzu-HsuanTsaiWu, Yung-FuYung-FuWuYen, Shi-ChernShi-ChernYen2008-12-172018-06-282008-12-172018-06-282003http://ntur.lib.ntu.edu.tw//handle/246246/92348application/pdf449834 bytesapplication/pdfen-USA study of copper chemical mechanical polishing in urea–hydrogen peroxide slurry by electrochemical impedance spectroscopyjournal articlehttp://ntur.lib.ntu.edu.tw/bitstream/246246/92348/1/06.pdf