High-Thermal-Conductivity Dummy Die and Finned Lid for Enhanced Liquid Cooling of 2.5D ICs

Hsin-Cheng LinChia-Wei TsengYu-Ying ChenHo-Ming TongCHEE-WEE LIU2025-05-192025-05-192024-12-03[9798331522001]https://www.scopus.com/record/display.uri?eid=2-s2.0-105001269756&origin=resultslisthttps://scholars.lib.ntu.edu.tw/handle/123456789/729415false[SDGs]SDG7High-Thermal-Conductivity Dummy Die and Finned Lid for Enhanced Liquid Cooling of 2.5D ICsconference paper10.1109/eptc62800.2024.109098102-s2.0-105001269756