The effects of solder volume and Cu concentration on the consumption rate of Cu pad during reflow soldering

Lin, Y.W.Y.W.LinWang, Y.W.Y.W.WangC. ROBERT KAOCHIEN-CHENG CHANG2012-10-242018-06-282012-10-242018-06-282010https://www.scopus.com/record/display.uri?eid=2-s2.0-76549094388&origin=resultslist&sort=plf-f&src=s&sid=3386dbe0d0c2eda2c872000cae6c24d2&sot=b&sdt=b&s=TITLE-ABS-KEY%28The+effects+of+solder+volume+and+Cu+concentration+on+the+consumption+rate+of+Cu+pad+during+reflow+soldering%29&sl=122&sessionSearchId=3386dbe0d0c2eda2c872000cae6c24d2&relpos=0en-USThe effects of solder volume and Cu concentration on the consumption rate of Cu pad during reflow solderingjournal article10.1016/j.jallcom.2009.11.0882-s2.0-76549094388http://ntur.lib.ntu.edu.tw/bitstream/246246/243915/-1/359.pdf