A study on the reaction between Cu and Sn3.5Ag solder doped with small amounts of Ni

Tsai J.Y.Hu Y.C.Tsai C.M.C. ROBERT KAO2019-11-272019-11-27200303615235https://www.scopus.com/inward/record.uri?eid=2-s2.0-0348107255&doi=10.1007%2fs11664-003-0012-7&partnerID=40&md5=ece7a47b56cd391c0236caee258562a2https://scholars.lib.ntu.edu.tw/handle/123456789/432724A study on the reaction between Cu and Sn3.5Ag solder doped with small amounts of Nijournal article10.1007/s11664-003-0012-72-s2.0-0348107255