Weng I.A.Hung H.T.Yang S.Chen Y.H.C. ROBERT KAO2019-11-272019-11-2720189784990218850https://www.scopus.com/inward/record.uri?eid=2-s2.0-85048831791&doi=10.23919%2fICEP.2018.8374676&partnerID=40&md5=9c044b05b367c0ec20cee79669af18c8https://scholars.lib.ntu.edu.tw/handle/123456789/432581Bonding of copper pillars using electroless Au platingconference paper10.23919/ICEP.2018.83746762-s2.0-85048831791