Novel crosstalk modeling for multiple through-silicon-vias (TSV) on 3-D IC: Experimental validation and application to Faraday cage design

Chang, Y.-J.Y.-J.ChangChuang, H.-H.H.-H.ChuangLu, Y.-C.Y.-C.LuChiou, Y.-P.Y.-P.ChiouWu, T.-L.T.-L.WuChen, P.-S.P.-S.ChenWu, S.-H.S.-H.WuKuo, T.-Y.T.-Y.KuoZhan, C.-J.C.-J.ZhanLo, W.-C.W.-C.LoYI-CHANG LUTZONG-LIN WU2018-09-102018-09-102012http://www.scopus.com/inward/record.url?eid=2-s2.0-84874455559&partnerID=MN8TOARShttp://scholars.lib.ntu.edu.tw/handle/123456789/372395Novel crosstalk modeling for multiple through-silicon-vias (TSV) on 3-D IC: Experimental validation and application to Faraday cage designconference paper10.1109/EPEPS.2012.64578842-s2.0-84874455559