Mechanical reliability assessment of Cu6Sn5 intermetallic compound and multilayer structures in Cu/Sn interconnects for 3D IC applications

Wu J.-Y.Kao C.R.Yang J.-M.C. ROBERT KAO2019-11-272019-11-272019978172811498905695503https://www.scopus.com/inward/record.uri?eid=2-s2.0-85072278860&doi=10.1109%2fECTC.2019.000-8&partnerID=40&md5=d38e97e8de593fbbc84c0632fe01fdc7https://scholars.lib.ntu.edu.tw/handle/123456789/432560Mechanical reliability assessment of Cu6Sn5 intermetallic compound and multilayer structures in Cu/Sn interconnects for 3D IC applicationsconference paper10.1109/ECTC.2019.000-82-s2.0-85072278860