Temperature effects on electromigration behavior of solder joints

Ke J.-H.C. ROBERT KAO2019-11-272019-11-2720109781424497836https://www.scopus.com/inward/record.uri?eid=2-s2.0-79951656069&doi=10.1109%2fIMPACT.2010.5699647&partnerID=40&md5=9dcb34ed16f30ccecb913ff8a6f8e347https://scholars.lib.ntu.edu.tw/handle/123456789/432651Temperature effects on electromigration behavior of solder jointsconference paper10.1109/IMPACT.2010.56996472-s2.0-79951656069