Low temperature direct electroless nickel plating on silicon wafer

Jain, C.-C.C.-C.JainWang, S.-S.S.-S.WangChuang, T.-H.T.-H.ChuangYang, S.-R.S.-R.YangTUNG-HAN CHUANG2020-05-122020-05-122009https://scholars.lib.ntu.edu.tw/handle/123456789/491999Low temperature direct electroless nickel plating on silicon waferjournal article10.1080/02533839.2009.96714902-s2.0-59049088877https://www.scopus.com/inward/record.uri?eid=2-s2.0-59049088877&doi=10.1080%2f02533839.2009.9671490&partnerID=40&md5=f691d66424dbe53ca917659a139097b2