Mechanisms for interfacial reactions between liquid Sn-3.5Ag solders and cu substrates

Chuang, T. H.T. H.ChuangWu, H. M.H. M.WuCheng, M. D.M. D.ChengChang, S. Y.S. Y.ChangYen, S. F.S. F.YenChuangTH2009-01-062018-06-282009-01-062018-06-282004http://ntur.lib.ntu.edu.tw//handle/246246/95944application/pdf235158 bytesapplication/pdfen-USMechanisms for interfacial reactions between liquid Sn-3.5Ag solders and cu substratesjournal articlehttp://ntur.lib.ntu.edu.tw/bitstream/246246/95944/1/86.pdf