Prior-to-bond annealing effects on the diamond-to-copper heterogeneous integration using silver�Vindium multilayer structure

Sheikhi, R.R.SheikhiHuo, Y.Y.HuoTsai, C.-H.C.-H.TsaiKao, C.R.C.R.KaoShi, F.G.F.G.ShiLee, C.C.C.C.LeeC. ROBERT KAO2021-02-042021-02-042020https://www.scopus.com/inward/record.url?eid=2-s2.0-85084088997&partnerID=40&md5=20934cceb2fa36de7fc5a6fc4c88d968https://scholars.lib.ntu.edu.tw/handle/123456789/546626Prior-to-bond annealing effects on the diamond-to-copper heterogeneous integration using silver�Vindium multilayer structurejournal article10.1007/s10854-020-03346-22-s2.0-85084088997WOS:000528116100001