Effect of multiple reflow cycles on ball impact responses of sn-4ag-0.5cu solder joints with immersion tin substrate pad finish

Lail Y.-S.Kao C.R.Chang H.-C.Lee S.-H.Kao C.-L.Lan W.-H.C. ROBERT KAO2019-11-272019-11-2720089781424436248https://www.scopus.com/inward/record.uri?eid=2-s2.0-64049103988&doi=10.1109%2fIMPACT.2008.4783806&partnerID=40&md5=b4411409dded19125d9c95ee98af7f69https://scholars.lib.ntu.edu.tw/handle/123456789/432685Effect of multiple reflow cycles on ball impact responses of sn-4ag-0.5cu solder joints with immersion tin substrate pad finishconference paper10.1109/IMPACT.2008.47838062-s2.0-64049103988