Effect of Cu concentration, solder volume, and temperature on the reaction between SnAgCu solders and Ni

Yang, S.C.S.C.YangChang, C.C.C.C.ChangTsai, M.H.M.H.TsaiC. ROBERT KAO2012-10-242018-06-282012-10-242018-06-282010https://www.scopus.com/record/display.uri?eid=2-s2.0-77953131590&origin=resultslist&sort=plf-f&src=s&sid=a96a0525f826ba1363b866baacd55e56&sot=b&sdt=b&s=TITLE-ABS-KEY%28Effect+of+Cu+concentration%2C+solder+volume%2C+and+temperature+on+the+reaction+between+SnAgCu+solders+and+Ni%29&sl=119&sessionSearchId=a96a0525f826ba1363b866baacd55e56&relpos=0en-USEffect of Cu concentration, solder volume, and temperature on the reaction between SnAgCu solders and Nijournal article10.1016/j.jallcom.2010.03.1682-s2.0-77953131590http://ntur.lib.ntu.edu.tw/bitstream/246246/243877/-1/321.pdf