Full-wave characterization of a through hole via in multi-layered packaging

Hsu, S. G.S. G.HsuWu, Ruey-BeeiRuey-BeeiWu2018-09-102018-09-101995http://scholars.lib.ntu.edu.tw/handle/123456789/317552Full-wave characterization of a through hole via in multi-layered packagingjournal article10.1109/22.3820682-s2.0-0029309831WOS:A1995QW25200012