Dissolution and interfacial reaction between Cu and Sn-Ag-Cu solders

Chang C.C.C. ROBERT KAO2019-11-272019-11-2720079781424416370https://www.scopus.com/inward/record.uri?eid=2-s2.0-48649107274&doi=10.1109%2fIMPACT.2007.4433566&partnerID=40&md5=5f82e4bb6a8ea65f6fbfb02712fec9cahttps://scholars.lib.ntu.edu.tw/handle/123456789/432690Dissolution and interfacial reaction between Cu and Sn-Ag-Cu soldersconference paper10.1109/IMPACT.2007.44335662-s2.0-48649107274